On 21^st August 2019, Teleflex Medical Sdn. Bhd held a ground breaking ceremony to begin their expansion plan in Phase 3, Kulim Hi-Tech Park. The ground breaking ceremony was held in the presence of the Vice President Strategic Manufacturing of Teleflex, Andrej Baranek, Teleflex Managing Director, Chuck Schrenk , Teleflex Head Manufacturing, APAC, Baskaran Balasubramaniam and Teleflex Director of Facilities, Strategic Manufacturing, Matthias Rohde.

The ceremony was also attended by KTPC Group Chief Executive Officer, Mohd Sahil Zabidi, Director of Magjaya Resources Sdn Bhd, Mr. Lin Tzu Hng and Director of BYG Architecture Sdn Bhd, Ben Yeoh.